Cantrell
Head-Fier
Does anyone have any experience with different metallurgical makeups of lead free bar solder for audio use tinning litz wire?
It's for use in a small sub 650g solder pot crucible.
A Popular 1 is SAC 305 SN 96.5, AG 3, CU 0.5%, but all are around $60-$65 USD plus shipping. Way too much for a 1 of project.
I'm considering some that are lead free SN 93-99.3% and CU 0.7-7%, but haven't found any info on audio use results. I do prefer Cu sound to Ag.
I'm ideally looking for something big enough for 550-600g crucible, sub $40 USD, uses virgin high quality/purity metal and works very well for audio use and tinning of enameled litz wire. Preferably made in N America, Japan or E.U. unless someone has had great results from stuff made in China or Taiwan and has a specific reliable retailer.
Thoughts and suggestions?
Or should I just use modest to lower quality bar solder to burn enamel off and do initial tin, then use solder wick to remove as much as I can and re-tin the ends with flux and audio grade wire solder?
I could also really use some help on best method/design, product/sources for IEM earcup wire section. Such as clear heat shrink for combination of strain relief and securing memory wire in place. So being flexible, relatively soft, safe for regular contact with skin & sweat and will last through regular use/bending along with keeping memory wire secure.
PE, PO, etc?
Dual or single wall?
Adhesive lined or regular?
Do I want something that shrinks down really tight, fairly tight, modestly tight or just tight enough to secure fairly well. I wonder about the flexibility aspect depending on how tightly it shrinks around wires. Whether 1.75:1 to 4:1 shrink ratio coupled with initial I.D. and the smallest final I.D. once shrunk. Then how thick the wall becomes with the various ratios and sizes also effecting flexibility along with what O.D. ends up in order to fit inside MMCX 4.0-4.4mm size type openings.
Anyone have specific product/store/link they've used with/does job & fits well inside of Eidolic MMCX?
Below the Y split will have Mod PC jacket (it's a bit too stiff and not soft enough IMO for IEM earcup wires) But I'm unsure if I should use silk (which I'll acid dye for great color, wear and light fastness) and if I do use it, should I cover each conductor in silk or do single silk jacket around each channel's bundle of wires?
Should it go over the top or just under the edge of heat shrink for memory wire?
I also still have questions about conductor metal arrangements for hot and ground. I'll have 4×25 AWG cryo UP-OCC Cu litz, 2× or 4× 28 AWG cryo UP-OCC solid core pure Ag, then possible option of adding anywhere from 2-4× 33-26 AWG Cu wire that's either OFC, OCC, Litz or regular stranded core wires. Ideal is more natural, lush, smooth, warmer sounding with good space, air, presentation, layering/cohesion, Soundstage, etc. along with great mids and female vocals.
So which metals and how many conductors for each hot/+ and ground/- ? Even split Cu/Ag 1 of each for +/-, 2× Cu +/2× Ag -, 2× Cu +/1× Cu - & 1× Ag -, 3× Cu +/ 2× Ag -, etc.
It's for use in a small sub 650g solder pot crucible.
A Popular 1 is SAC 305 SN 96.5, AG 3, CU 0.5%, but all are around $60-$65 USD plus shipping. Way too much for a 1 of project.
I'm considering some that are lead free SN 93-99.3% and CU 0.7-7%, but haven't found any info on audio use results. I do prefer Cu sound to Ag.
I'm ideally looking for something big enough for 550-600g crucible, sub $40 USD, uses virgin high quality/purity metal and works very well for audio use and tinning of enameled litz wire. Preferably made in N America, Japan or E.U. unless someone has had great results from stuff made in China or Taiwan and has a specific reliable retailer.
Thoughts and suggestions?
Or should I just use modest to lower quality bar solder to burn enamel off and do initial tin, then use solder wick to remove as much as I can and re-tin the ends with flux and audio grade wire solder?
I could also really use some help on best method/design, product/sources for IEM earcup wire section. Such as clear heat shrink for combination of strain relief and securing memory wire in place. So being flexible, relatively soft, safe for regular contact with skin & sweat and will last through regular use/bending along with keeping memory wire secure.
PE, PO, etc?
Dual or single wall?
Adhesive lined or regular?
Do I want something that shrinks down really tight, fairly tight, modestly tight or just tight enough to secure fairly well. I wonder about the flexibility aspect depending on how tightly it shrinks around wires. Whether 1.75:1 to 4:1 shrink ratio coupled with initial I.D. and the smallest final I.D. once shrunk. Then how thick the wall becomes with the various ratios and sizes also effecting flexibility along with what O.D. ends up in order to fit inside MMCX 4.0-4.4mm size type openings.
Anyone have specific product/store/link they've used with/does job & fits well inside of Eidolic MMCX?
Below the Y split will have Mod PC jacket (it's a bit too stiff and not soft enough IMO for IEM earcup wires) But I'm unsure if I should use silk (which I'll acid dye for great color, wear and light fastness) and if I do use it, should I cover each conductor in silk or do single silk jacket around each channel's bundle of wires?
Should it go over the top or just under the edge of heat shrink for memory wire?
I also still have questions about conductor metal arrangements for hot and ground. I'll have 4×25 AWG cryo UP-OCC Cu litz, 2× or 4× 28 AWG cryo UP-OCC solid core pure Ag, then possible option of adding anywhere from 2-4× 33-26 AWG Cu wire that's either OFC, OCC, Litz or regular stranded core wires. Ideal is more natural, lush, smooth, warmer sounding with good space, air, presentation, layering/cohesion, Soundstage, etc. along with great mids and female vocals.
So which metals and how many conductors for each hot/+ and ground/- ? Even split Cu/Ag 1 of each for +/-, 2× Cu +/2× Ag -, 2× Cu +/1× Cu - & 1× Ag -, 3× Cu +/ 2× Ag -, etc.