As far as smartphones go, I'm just waiting for Samsung to announce the inevitable Galaxy Note IV before the end of the year so I can step up to that when my contract expires in December.
I normally wouldn't be itching to replace my Galaxy S III that quickly, but I really want that Wacom digitizer!
Bit high? No kidding!
I used Prolimatech PK-3, which is an absolute pain to spread out (though I didn't use the "bag and boil in water" trick some suggested to soften it). It's reviewed as one of the best thermal compounds on the market, only edged out by Gelid GC-Extreme (which I only found out AFTER buying a big tube of PK-3).
I don't think that's the problem at the moment, but rather what Intel slipped underneath that heatspreader, if not the way the IHS is glued to the CPU package.
If the usual Liquid Pro/Ultra underneath the IHS is good enough to justify not leaving that poor, fragile die exposed, I might just keep the IHS for peace of mind.
My main concern has to do with a few reports of that liquid metal stuff drying out eventually after a year or two and spiking up temps far worse than they initially started off at. Needless to say, I want this to be a "set and forget" solution underneath the IHS, no pump-out or other crap. Almost makes it seem like it's more practical to just go bare die mount and take the IHS completely out of the equation.
MSI or some other manufacturer should sell these replacement LGA1150 braces separately, ready to mount on any motherboard.
Ambient temps were guesstimated by mobo temps and the upstairs thermostat, though the computer itself is downstairs in a different room. I need a proper thermometer. This I will say, though: it's Georgia, it's summer time, and back during winter when idle temps were sub-30c, I had to wear a jacket down there to keep warm! I don't need to do that now due to the general increase in ambient temps.