tomb
Member of the Trade: Beezar.com
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Quote:
No problem, cfcubed.
The Starving Student thread takes input from the whole community.
I strongly suspect that we will need to slap a heat sink on the top of the case, but have left that conclusion up to real findings. You note the small 1.5W in your CTH, but was it actually mounted to the case metal? There's a big difference in that respect. I know in building several MAXes, just the addition of the handle bars (heavy-weight drawer pulls) on top of the MAX cases brought the case temperature down significantly, regardless of how much was generated inside.
Again, Dsavitsk has suggested that heat sinks may not be necessary when the MOSFETs are bolted directly to the lid. His findings were based on the Hammond "N" case, though, which has more metal than the "L" case we're attempting to use for the SSMH PCB. So, the question remains whether the "L" case can reject that heat. I'm think the addition of an exposed heat sink - or a couple of drawer pulls - whether they're directly connected to the MOSFET bolts or not, may be all that's necessary to make up the difference in exposed metal from the "N" case to the "L."
That's the reason we're prototyping, though.
| Originally Posted by cfcubed /img/forum/go_quote.gif One thing I learned doing my compact hybrid build I'd like to share WRT case-mounting devices as heatsinking... Depending on case size + dissipation, you may not like the result. Haven't followed this, so don't know the dissipation here or whether there is already a full, target-case proto using case-mounting as heat-sinking (or even if that's the plan
The main heat-producer in the CTH other than the tube is it's LV reg. I measured its apparent dissipation at about 1.5W (not so much). When case-mounted it brought the entire enclosure to about 50C (albeit, a bit smaller enclosure then this PCB build is shooting for)... I'd consider use of a proper heatsink instead, be it internal (w/assoc air holes) or external. When I did this, the case temp dropped nicely. It's really personal opinion tho because the components are perfectly happy at such temps even if your hands aren't
tomb - If you think this post is not applicable here, just let me know. |
No problem, cfcubed.
I strongly suspect that we will need to slap a heat sink on the top of the case, but have left that conclusion up to real findings. You note the small 1.5W in your CTH, but was it actually mounted to the case metal? There's a big difference in that respect. I know in building several MAXes, just the addition of the handle bars (heavy-weight drawer pulls) on top of the MAX cases brought the case temperature down significantly, regardless of how much was generated inside.
Again, Dsavitsk has suggested that heat sinks may not be necessary when the MOSFETs are bolted directly to the lid. His findings were based on the Hammond "N" case, though, which has more metal than the "L" case we're attempting to use for the SSMH PCB. So, the question remains whether the "L" case can reject that heat. I'm think the addition of an exposed heat sink - or a couple of drawer pulls - whether they're directly connected to the MOSFET bolts or not, may be all that's necessary to make up the difference in exposed metal from the "N" case to the "L."
That's the reason we're prototyping, though.
