GregVDS
100+ Head-Fier
- Joined
- Jul 7, 2005
- Posts
- 144
- Likes
- 10
Thanks AMB,
I checked the spec sheet, I used a kemet tantalum T35 serie, and yes the upside down L is completed by a tiny + near one of the leg. Everything is ok at the moment
Tonight, I finish the PSU I think (heatsink, big caps and toroidal transfo, and cabling). I will maybe go slow, to avoid any stupid errors, as desoldering something gives me nightmares.
I realized I ordered 9 x 330µF nichicon UHE for M³ C7, hence I can have as much as 2970 µF (I know, +- 10%). Is this not too much? Should I put only 6 (1980 µF)?
I followed the C2 C8 discussion, I stick to the plan so, yep? There is no need to avoid or change these, maybe polypropylene 0.1µF in place of C2?
what's the name of the tiny bits that are pushed in the heatsink taping holes of the STEPS, that are used to be soldered on the pcb to fix the heatsink, and can I find these alone?
I read again the initial setup, is it not dangerous to lead-test R9 being so close to the heatsinks (V+ right?) What if a short between V+ and R9 either before or after?
Should I use multistranded wires for voltage and mains?
And how do you heatshrink the heatshrink? I always end burning it.
AMB, Close to the C8 close to the D1, there are two holes not used, one could take V+ and ground from there?
What is the best way to clean the solder iron tip, the humid foam - sponge, to sand it a little bit before heating it, a kind of white stone similar to Alun or something like that?
Thanks for all,
GregVDS
I checked the spec sheet, I used a kemet tantalum T35 serie, and yes the upside down L is completed by a tiny + near one of the leg. Everything is ok at the moment
Tonight, I finish the PSU I think (heatsink, big caps and toroidal transfo, and cabling). I will maybe go slow, to avoid any stupid errors, as desoldering something gives me nightmares.
I realized I ordered 9 x 330µF nichicon UHE for M³ C7, hence I can have as much as 2970 µF (I know, +- 10%). Is this not too much? Should I put only 6 (1980 µF)?
I followed the C2 C8 discussion, I stick to the plan so, yep? There is no need to avoid or change these, maybe polypropylene 0.1µF in place of C2?
what's the name of the tiny bits that are pushed in the heatsink taping holes of the STEPS, that are used to be soldered on the pcb to fix the heatsink, and can I find these alone?
I read again the initial setup, is it not dangerous to lead-test R9 being so close to the heatsinks (V+ right?) What if a short between V+ and R9 either before or after?
Should I use multistranded wires for voltage and mains?
And how do you heatshrink the heatshrink? I always end burning it.
AMB, Close to the C8 close to the D1, there are two holes not used, one could take V+ and ground from there?
What is the best way to clean the solder iron tip, the humid foam - sponge, to sand it a little bit before heating it, a kind of white stone similar to Alun or something like that?
Thanks for all,
GregVDS