https://www.cool3c.com/article/175122
For fans who are used to looking at the specifications first, the NW-WM1ZM2 and NW-WM1AM2 do not have significant data improvements compared to the previous generation models, including the use of the same S-Master HX chip, the same power output, and the more significant specifications. The only difference is that the screen is enlarged, the use of USB Type-C to replace the long-standing WM Port, and the DSD support for higher specifications, etc., but where consumers can't see from the data is also the mystery of audio tuning .
Hiromi Sato also re-emphasized that although there are many high-end DAC chip products with beautiful specifications and data on the market, the S-Master chip developed by Sony for portable devices is still Sony's most suitable architecture for portable playback devices, because commercially available general-purpose devices Although the high-end DAC chip has beautiful data on the book, it also needs ample motherboard space and component matching to realize the theoretical data. This is why the DMP-Z1 previously developed by Sony in pursuit of the ultimate is so huge. At least the layout of the DMP-Z1 must be used for the best effort, but in this way, it is contrary to the type of portable player.
The S-Master HX chip is smaller than the traditional audio DAC chip and has excellent energy efficiency
Designed by Sony's engineering department, the S-Master chip is a highly integrated chip that integrates DAC and expansion. Not only is the chip less than half the size of a traditional audiophile DAC, but it also uses simultaneous digital signal processing and amplification to further reduce distortion. , and through the digital volume control based on changing the voltage, the sound quality degradation of the traditional analog volume at low volume can also be avoided. At the same time, due to the digital architecture, once a clean and stable power supply is used, the sound can also be improved. How to further play The potential of the S-Master is also the subject of this new model.
Details that are invisible from appearance and data specifications further evolve sound quality
Digital and analog partitions can be said to be basic disks
Excluding the core system and S-Master HX, the evolution of the core components of NW-WM1ZM2 and NW-WM1AM2 is quite complicated, from PCB technology, soldering, audio components to chassis material and structure, etc., are completely different from the previous generation. , but this time the two models only have differences in the chassis, internal cables and storage capacity, unlike the previous generation where the components on the motherboard are also slightly different, making the performance gap between the two models even narrower, and it may be difficult to distinguish without listening carefully. level, but if you analyze it further, you can feel that subtle component differences can also make a difference in the final listening experience.
▲The audio components developed in-house are all in pursuit of higher sound quality
The circuit design of NW-WM1ZM2 and NW-WM1AM2 follows the principle of partitioning of digital and analog architectures. At the same time, copper masks are added to the digital processor and storage memory blocks that are prone to interference. The motherboard PCB not only uses more Thick copper film, using low dielectric conductivity material on the insulator, also fills the hole to further reduce the conduction resistance.
▲The circuit board design of the two new models, please pay attention to the large-capacity FT-CAP3 lying above the digital block
The audio components used in the NW-WM1ZM2 and NW-WM1AM2 have also been further improved. In addition to the large copper-plated resistors and film capacitors developed in-house by Sony, the FT-CAP solid polymer capacitors introduced into products in 2015 have also been upgraded to In the third generation, Hiromi Sato emphasized that the performance of the FT-CAP3 this time can be said to be a masterpiece. At the same time, according to the design requirements, a large-capacity long-leg capacitor was specially customized for the power supply part, so that this large-capacity FT-CAP3 can be Turning to 90 degrees lying on the circuit further improves the stability and purity of the power supply. At the same time, the crystal oscillator has also changed from silver-plated to gold-plated with lower impedance in the previous generation, which further reduces the signal transmission impedance.
The key components of the two models are made of gold-containing solder
As for the audio solder used to connect components, it has also evolved again. This time, all solder materials containing gold are used. Gold-containing solder can reduce impedance and allow high frequency extension. However, the proportion will be too much. The solder used this time is also The formula that Sony has completed after many attempts, and in the era of DMP-Z1, the welding wire that can be used for manual welding has been completed, but only for parts that are partially welded by hand, and the NW-WM1ZM2 and NW-WM1AM2 are completed with After the gold solder paste is developed, the solder paste is used directly for the connection of components.
