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Originally Posted by GregVDS
-First, I want Crossfeed, so, I just put the crossfeed (linkwitz, tangent pcb implementation) in front of the M³ circuit, between RCA and M³ pcb input, right? How will interact the volume pot with the crossfeed? should I buffer the crossfeed between two OpAmp unity gain stages?
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If you use the "high-Z" version of the crossfeed circuit then yes, it goes between the RCA input and the M³ pcb input. The volume pot should have little interaction with the crossfeed. Note that the crossfeed circuit will introduce a 6-10dB loss, so depending on your source and headphones you may need to increase the gain of the amplifier to make up for it.
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-AMB specific, what is the meaning of "Boutique grade", for Cerafine, very good, or barely ok? (I show my french-speaking-guy limits here, sorry) |
Cerafine is considered boutique-grade. Generally, anything that are labeled specifically "for audio" and then priced significantly above standard stuff are "boutique".
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-Consequently, are there big differences between Nichicon UHE serie and Elna Cerafine, for the last ones are difficult to find? |
In the M³, electrolytic capacitors are only used in the power supply rails, not in the signal path. In my opinion there is no advantage of using Elna Cerafine over Nichicon UHE in this application, but don't let me stop you from using the boutique stuff.
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-Can I use Orange Drop polypropylene rated 200~400v for CBB? Is it worth it? |
You can use the Orange Drop if you like, as long as it physically fit the board and the leads not too thick to go through the holes. The high voltage rating is total overkill and not needed in this circuit.
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-My main music source will be the line out (not headphone jack, the one intended for hifi amp line in) of my 3rd generation iPod. I measure dc offset between right and ground, left and ground, in mV, correct? |
Yes.
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What amount is tolerable, only nothing, some thenth of mv, some mv? |
Any DC offset at the input to the amp will be amplified by the gain of the amp (at max volume). The amount of DC offset that is tolerable depends on the type of headphones you have. Lo-Z phones are more likely to be damaged by offset, and I would suggest no more than a few mV maximum at the input of the amp.
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-I the same context, How could I tackle down this DC offset if there is one? |
Insert a coupling capacitor, either at the output of the offending source, or at the input of the M³ amp to block the DC.
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-Can it be possible to lower the 1.5'' heatsink a little bit by sanding out some millimeters of material? which extremity, from the base or the top? |
If you must grind down the height, do so at the top of the heat sink.
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-I want to use a par-metal case (Thrice could answer me on these ones maybe?) and have a custom one (10'' x 8'' x 2'', hence the heatsink question) what screws are used, and would it be possible to replace front, top and back by top panel express ones? |
If you use short standoffs (like 1/8") and apply an insulating plastic sheet below the board to keep anything from touching the case, then the board with 1.5" heat sinks will fit in the 2" tall Par Metal case. However this arrangement will cause your volume/bass boost knobs to be a bit below the center line of the front panel.
All screws in the Par Metal 20 series are 6-32 thread machine screws. You can replace the front with a custom panel from Front Panel Express but all the other pieces have bends in them. I am not sure Front Panel Express will make such pieces.
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-Someone heard something about a 'Mark Burson Super OpAmp', with figures at least ten times better than the OPA627, look into ebay, australian product, is this for real? |
Don't waste your money. It's a scam.
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-Volt gain is computed from R3 and R4, but for volume pot turned to max, or do I miss something? |
Yes. When we speak of amplifier gain we imply the volume at max position. The volume control then introduces a loss (from none at maximum to 100% at minimum).
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Its for power rail decoupling. There can be any number of them, and since there is room for 4, we put 4 in there.
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Because R2G already serves that purpose.
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Yes.
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-Useful to have an internal metal divider between step and M³ pcb's? Par-metal 20-series has this option. |
Yes.
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-I want to use a 4 pole 3 position rotary switch for Linkwitz; is it possible to position it just above the big M³ inscription on the pcb, or the heatsink is too close to the front panel (having in mind my wish to use the shafts of pots through the front panel) |
You will have to determine this yourself, based on the dimensions of your switch and how you would mount the board and switch.
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-What shielded wire to use, or how to shield a wire? |
If your input wiring is not longer than a few inches then there is no need to use shielded wires. Just twist the ground and signal wires together. If you have longer runs, then use coaxial shielded wires, like a microphone cable.
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for C7, what's better: 9 x 330µF, 6 x 470µF, 3 x 1000µF? |
All else being equal, 9x330 would provide the lowest ESR, but all else is not equal even between selections of the same line of capacitors. In reality it is not going to make much difference. We provide holes on the board for those who obsess about these things so they could do what they like.