Call for third party X7 expansion module developers
--by James Chung, CEO of FiiO
Any interested designers / companies may email us directly at
market@fiio.net!
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As you may know, one big selling point of the X7 is its patented interchangeable expansion module. The expansion capability of this module is theoretically unlimited. For a start, headphone amps of different power / style may be made into modules for the X7. In the more advanced case, other DACs may also be built into the module, taking the place of the built-in ES9018S. One can even make a module to expand the X7’s storage and battery capacities.
Currently, the expansion modules officially planned for development / production
by FiiO include:
Standard (IEM) module: suitable for driving most IEMs, earbuds, portable on-ear earphones and some efficient full-size headphones.
Medium power module: utilizing the renowned MUSE02 op-amp for higher output power and wider application.
High power module: Use of the LM49600 op-amp planned for power amplification of full size headphones.
Balanced output module: having 4-pin Kobiconn and 2.5mm balanced output ports, this will be the amp to have for various headphones / earphones on the market with balanced cables.
But I predict that, no matter how many different modules we make, the finite resources of our own company will be insufficient to meet everyone’s audio demands. For example, I predict that the following modules are just a few of the many that will find favor in the market:
Class A module: for those who are paranoid about crossover distortion and negative feedback
Tubey module: utilizing an op-amp with tubey sound sig, this module will add its own signature to the music, perhaps via even order distortions.
Basshead module: see title.
Vocals module: highlights the vocal bands, suiting the tastes of certain Hi-Fi enthusiasts, especially in China.
Female vocals module: aims to make female vocals as addictive as drugs.
ACG module: your solution to Fitear Monets not shipping overseas…
My thoughts are,
1. We will publicize the connector specifications for our expansion modules, both mechanically and electronically, including such details as PCB dimensions, connector dimensions, various signal voltages, currents, timings and protocols.
2. We will sell outer shells, inner chassis and fastening screws as development kits to third parties.
3. Third parties may design third party modules with the aid of the specifications and kits we provide.
4. After design is complete, they may provide us with samples of their completed modules for safety / reliability testing and certification. If they pass such tests, we will provide their modules with our certification logo and provide them with batch supplies of shells and chassis for their use in mass production of the modules. We won’t attempt to ban the production of uncertified modules, although we will not provide them with batches of shells and chassis.
5. The third parties may sell the modules themselves, or they may consign them to us for sale through our channels.
6. If the third party is willing, and we believe in the market value of the module, we can also purchase the exclusive rights to their module design for our own production and sale.
7. Limited edition modules may be available in the future, with e.g. special colours, design elements, etc. to increase customizability of the X7.
8. Third party expansion modules may be priced at the third party’s discretion, although we will of course offer our suggestions.
I hope this will create a win-win situation for all involved: consumers will have choices of more modules; aspiring designers will be able to have people throughout the world see and hear their designs through the FiiO X7; and we may increase the X7’s customizability and marketability. Any interested designers / companies may email us directly at
market@fiio.net.