(9) In-ear monitors preview and existing product information
This is a comprehensive chapter, and the reasons are complicated. In general, the wired HiFi IEM market has greatly declined, while competitions are fierce. The wired HiFi IEM technology is relatively mature, and it is hard to create something new for consumers. We are negative about the entire dynamic/balanced armature IEM market. Therefore, we did not plan many new models. Besides, some old models have less inventory. We will just let them go once they are sold out.
Here are some new models we are planning.
1. FD11(NEW), expected to be available in the summer
The FD11 is a new generation of the FD1. The ID design this time is more innovative, the material has also been upgraded to metal, the diaphragm uses the highly welcomed carbon-based one as used in the FF5, and the acoustic cavity also has some adjustments.
All in all, there are some possibilities in the low-end pure dynamic IEM market. After all, with the same cost, dynamic IEM has the highest sound to price ratio. High-end dynamic IEMs need more backgrounds, as well as rare and costly diaphragms and materials. If we make the sound over 300 USD with a cost of 30 USD, we would still set the price within dozens of US dollars.
Therefore, we will not consider the development of high-end dynamic IEMs this year for the time being.
2. FA19 (new), expected to be available in the fall
This is an IEM model with ten balanced armature units on each side. The current situation is that single dynamic driver and double BA IEMs are not very popular. The main reason is also because of the fierce competition, especially some domestic BA IEMs which are sold at an over-low price. Moreover, basically all earphone factories are incapable of developing balanced armatures. They jointly developed or customized BA drivers, making use of technologies from driver developers like Knowles.
In theory, if the number of the BA driver is small, it will cause two results: difficult to get a good sound and achieve differentiation. However, manufacturers have more space for multiple BA combinations. In addition, it is easier for multiple BA IEMs to take advantage of balanced armatures, and make characteristics in terms of sound density and frequency response.
3. Planar in-ear-monitors (new), expected to be available in the fall
Last year was a popular year for planar IEMs when many brands introduced theirs. All the time, planar headphones and speakers attract a lot of audiophiles because of their unique timbre. We can simply think that common dynamic/BA IEMs make sounds through a point, while planar IEMs make sounds through a plane. Therefore, planar IEMs have a unique charm in timbre.
Audiophiles are usually more attracted by new technology, new types and new styles. So, with the technology development of driver manufacturers, the improvement of driver quality, as well as the cost reduction, many planar IEMs are coming up all of a sudden.
Of course, there were reasons why we would develop them late. It is because we wanted to differentiate our products from others. Even if using the same driver unit, we are planning to custom an electrostatic driver with totally different specifications, so that we can achieve a unique "FiiO" sound without being limited by the public molded driver.
4. DD+BA Hybrid electrostatic earphones (NEW), expected to be available in the fall
Like the planar IEMs, ever since sonion introduced the electrostatic driver a few years ago, many brands have started to apply this driver type to their high-end IEMs. Earlier, electrostatic drivers were expensive yet with less mature technology. Most importantly, they were not available in large quantities.
In the past two years, the supply chain has improved greatly. At the same time, both consumers and manufacturers have a clearer understanding of the application of electrostatic drivers.
Especially most recent electrostatic earbuds have adopted 4 electrostatic drivers on each side, so that the electrostatic unit does not become an ornament because of over-low sensitivity.
All in all, it will be an appropriate time for FiiO to release DD+BA hybrid electrostatic IEMs.