jdkJake
1000+ Head-Fier
- Joined
- Mar 16, 2009
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Quote:
That's a three inch high ParMetal isn't it? How is the heat? I was going to go the same way bit am worried about heat buildup in the case.
Just an update. I ran last night for almost two hours with the chassis instrumented to monitor thermal build-up. I placed the thermocouple in what I suspect to be the worst place for heat build up. You can confirm where that point is just by feeling around the top of the case. Recall the picture of my inside mounting, from back to front, I placed the thermocouple right in front of the dual e12's and behind the star ground terminal strip at a height equal to the top of the sidemounted e12 PCB. This is perhaps slightly higher than the heatsinks but underneath the top panel such that is was not touching the top panel.
Room temp was ~77 or 78F (~25C) but varies a bit as the HVAC is set at 76F, but, all the electronics, computers and lights make it vary a fair amount. After about an hour or so, the internal temp at that point was pretty solid at 55C (~131F). Toasty, but not too unreasonable. The top of the case is hot, but, you can hold your hand on it without discomfort.
If this case temp causes concern, then I would suggest those who use the 12x12x3 Par Metal have them run another row of vent slots right down the middle of the top panel. That should provide more than enough convection cooling for the case. I am considering having that done as I have some painting errors I need to correct on that part anyway.