I opened my iCan SE after finding it hot at random times, regardless of playing/idling and found the TPA6120 very hot, I couldn't touch it for more than 1 second without burning my finger. Then I did the same thing for 2 other implementations and they were always near body-temperature warm, even when playing loud. Those other 2 implementations had almost the same maximum power of the iCan SE. Why did iFi make the chip in the iCan SE run that hot? The tiny chip basically heats up an entire aluminium case almost by its own (other parts were only slightly warm or downright cold). Is it the "A class" thing? Was this a neccessity or even needed? I can't hear any improvement over other cold-running amps with the same chip.
I also talked to 3 people who got their iCAN SE burned in the summertime, although I believe they had a wallwart problem, since my wallwart runs cold even when the amp is hot, but their wallwarts were overheating. I'm a bit afraid nonetheless
And why aren't there any perforations in the case if it's been made to run that hot? At least on the sides, so dust wouldn't get in that easily.
How long should I expect the iCan SE to last in these conditions? I'm not very optimistic, although I may nontheless be wrong and it could last for a long time despite the heating of the chip. I'm also a bit worried about the electrolytics near the chip, they get a bit warm too and they're only 85 C degrees rated for 1000h. So for 50C they would theoretically last for 1 and a half year if let plugged in continuously.
Will iFi ever make a non-portable (no battery) headphone amplifier with 3D/xBass without a hot running chip? Maybe even USB powered? Or add 3d/xbass to the iDAC2 in the next generation? I would like something cooler and simpler, without a wallwart, like the iDAC2, but the 3D is a must for me, so I'm tied to the iCan SE without needing it other than for the 3D function.