OSSIC
New Head-Fier
- Joined
- Feb 16, 2017
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Hello Head-Fi Community, team OSSIC here representing the OSSIC X 3D Audio headphones. We wanted to make an introduction post outlining our vision for audio, as well as explaining some of integral differences between the OSSIC X and normal stereo headphones. We hope this sparks some communication around spatial formatting and the future of multi channel sound.
The OSSIC X is a precision engineered and highly-technical audio product designed to automatically calibrate to the listeners anatomy to provide a 3D audio experience. While it may take the shape of a headphone, it is much more than that. The X is a premium audio device, featuring more drivers, more processing power, and more internal components than any headphone on the market today.
Custom Driver Design
Within each each ear cup are multiple custom drivers that have been custom tuned for 3D audio playback to ensure they work in sync to playback tailored frequency responses to your based on your HRTF as well as the sound location. This allows the sound to interact with the unique portion of your ear the same way it would in real life.
Sensors for Instant Anatomy Calibration and Head Tracking
The design features of the OSSIC X put your ear at the center of it all. Embedded sensors have been arranged at precise points within the headphone to enable instant calibration to the unique listening anatomy of each listener. This creates a tailored 3D audio experience that not only increases sound quality, but also drastically improves the accuracy of sound placement within the virtual soundspace.
Internal Digital Signal Processor
In order to do the complex calculations needed to process accurate 3D audio that's calibrated to you, the OSSIC X comes equipped with an internal, and highly powerful digital signal processor (DSP). This mini-audio computer ensures the algorithms run smoothly in tandem with the incoming sensor data to enable 3D audio playback.
Precision Fit. Precision Movement.
The OSSIC X is specifically tuned to allow a fit that is comfortable while ensuring optimum sound transfer to the ears. To provide that fit, each ear cup rests within a unique multi-directional movement system that features machined metal bushings for precise mechanical movement. Connected to those ear cups is the thermoplastic headband, which was constantly tested and improved to ensure a secure fit during use. Additionally, advanced polymers were added to the headband-adjust components for long life and an incredibly smooth experience for the user.
A Band that’s Never Broken
Durability played a major role in the design choices that went into the OSSIC X, the headband especially. While typically considered a breaking point in most headphones, the headband of the X is just the opposite. It features an engineered thermoplastic headband that is lightweight and comfortable while still handling bends, drops, and twists of everyday use.
Thermal-Cooling Aluminum Ear Cups
The ear cups boast a stamped aluminum housing engineered to decrease weight and increasing durability, while also acting as a thermal conductor to naturally move hot air away from the internal processing components of the headphone. This increases comfort over extended periods of use.
Soft Pads for Improved Comfort and Sound
Comfort was a top consideration throughout the engineering process. The ear pads and head pads of the OSSIC X feature a soft micro-fiber material that provides a comfortable fit for extended periods of use. Internal material of the pads is a memory foam that improves the comfort and acoustic seal. Additionally the pads can be easily removed and washed to extend the life of the headphone.
The OSSIC X is a precision engineered and highly-technical audio product designed to automatically calibrate to the listeners anatomy to provide a 3D audio experience. While it may take the shape of a headphone, it is much more than that. The X is a premium audio device, featuring more drivers, more processing power, and more internal components than any headphone on the market today.
Custom Driver Design
Within each each ear cup are multiple custom drivers that have been custom tuned for 3D audio playback to ensure they work in sync to playback tailored frequency responses to your based on your HRTF as well as the sound location. This allows the sound to interact with the unique portion of your ear the same way it would in real life.
Sensors for Instant Anatomy Calibration and Head Tracking
The design features of the OSSIC X put your ear at the center of it all. Embedded sensors have been arranged at precise points within the headphone to enable instant calibration to the unique listening anatomy of each listener. This creates a tailored 3D audio experience that not only increases sound quality, but also drastically improves the accuracy of sound placement within the virtual soundspace.
Internal Digital Signal Processor
In order to do the complex calculations needed to process accurate 3D audio that's calibrated to you, the OSSIC X comes equipped with an internal, and highly powerful digital signal processor (DSP). This mini-audio computer ensures the algorithms run smoothly in tandem with the incoming sensor data to enable 3D audio playback.
Precision Fit. Precision Movement.
The OSSIC X is specifically tuned to allow a fit that is comfortable while ensuring optimum sound transfer to the ears. To provide that fit, each ear cup rests within a unique multi-directional movement system that features machined metal bushings for precise mechanical movement. Connected to those ear cups is the thermoplastic headband, which was constantly tested and improved to ensure a secure fit during use. Additionally, advanced polymers were added to the headband-adjust components for long life and an incredibly smooth experience for the user.
A Band that’s Never Broken
Durability played a major role in the design choices that went into the OSSIC X, the headband especially. While typically considered a breaking point in most headphones, the headband of the X is just the opposite. It features an engineered thermoplastic headband that is lightweight and comfortable while still handling bends, drops, and twists of everyday use.
Thermal-Cooling Aluminum Ear Cups
The ear cups boast a stamped aluminum housing engineered to decrease weight and increasing durability, while also acting as a thermal conductor to naturally move hot air away from the internal processing components of the headphone. This increases comfort over extended periods of use.
Soft Pads for Improved Comfort and Sound
Comfort was a top consideration throughout the engineering process. The ear pads and head pads of the OSSIC X feature a soft micro-fiber material that provides a comfortable fit for extended periods of use. Internal material of the pads is a memory foam that improves the comfort and acoustic seal. Additionally the pads can be easily removed and washed to extend the life of the headphone.
