[MWP]

Hi all,

Sorry if this question doesnt belong in this forum...

I have drawn a custom footprint for a through-hole component ill be using (3pin power module).
The foot print only uses the normal through-hole pads and outline using top overlay lines.

The footprint outline is 40x40mm with the three pads down one side.

For some reason when i try to flip the component using the footprint onto the bottom layer, the outline creates errors with SMD components on the top layer.

Does anyone know why?

Other normally top layer SMD components can be used on the bottom layer with no problems... i cant see why my footprint doesnt work in the same way.

Thanks.

 

[Garbz]

What error? You'll need to be more specific if you want help. Does the error always generate or only if there's an SMD components on there? Run a Digital rule check and tell us which error comes up, and also show us the current settings for that rule.