Syzygies
500+ Head-Fier
- Joined
- Nov 16, 2004
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I need to make a MINT board as thin as possible, on the resistor/IC/diode side (plan). I'm struck by the constrast in how little solder one uses in refined surface mount technique, compared to the tiny solder mountain ranges one sees on the solder side of through-hole boards. I have a good iron and reasonable technique.
My plan is to glue each 1/8 watt resistor in place (working carefully, no backing out), snip the leads flush with the underside of the board, then solder carefully as if surface mount, filling each hole around each lead without making a mound of solder. The glue is both scaffolding, and added strain relief for the components.
Do the solvents in some glues compromise resistors and diodes? Is there a better way to achieve the same result? I'd rather get it right the first time than attempt sanding afterwards.
My plan is to glue each 1/8 watt resistor in place (working carefully, no backing out), snip the leads flush with the underside of the board, then solder carefully as if surface mount, filling each hole around each lead without making a mound of solder. The glue is both scaffolding, and added strain relief for the components.
Do the solvents in some glues compromise resistors and diodes? Is there a better way to achieve the same result? I'd rather get it right the first time than attempt sanding afterwards.