[tangent]

Quote:

How about making a set of surface mount pads inside the DIP 8 pads for the main opamp.

Neat idea. On first look at the current board route, I don't know if we can swing this, but it's worth a look.

 

[aos]

Yes, I'm actually quite surprised that didn't make mentioned before let alone done in the even 1st version. When I think about generalized PCBs, first thing on my mind is a land pattern of DIP with smaller SOIC inside... But that might just be me, I'll be dreaming PCBs pretty soon.

Anyway, I think it's something that should definitely be in the next version if at all possible. To me personally not using AD8610/20 is not an option and getting adapters is not only inconvenient and expensive (extra s&h, taxes...) but electrically inferior.

Depending on your PCB design software it might be anything from trivial to daunting, and then there's rework if you had traces below the chip...

 

[Gariver]

Tangent:

Most of the problems with the volume pot could be solved with those Molex/GC Waldom connectors you mention at your site (META42 Breadboarding).

I just hope you expand that section of your site a little bit. Why? I've never worked with those Molex connectors. I mean, I don't even know what to order, what to use for crimping, etc. I do realize, however, that the Molex connectors do offer lots of flexibility. That's really nice.