Thanks for the follow up! Wouldn't this be side dependent? The R channel doesn't flow through that side. It's also in my opinion much harder to cut the wires on that side, remove the enamel coating and create a good solder joint, especially with such small guage wires. I will reball a BGA and do SMD work before I touch headphone magnet wire . Maybe the other side of yours is different, but mine is just the R channel wire running straight through with no breaks or solder points. I do like your heat shrink idea though. I have no plans to reopen mine so I did glue them shut. I glued the board down to the little retention bits and glued the plastic pins back in.