Never use an hot air dryer on elecrtonic chips.
The silicium die is encapsulated in a ceramic matrix polymer (the black part of the chip), when flooded, the water penetrate into the matrix polymer.
If you apply hot dry air on it, the water evaporate immediately and generate a very high pressure into the chip (particulary at the junctions)
In most cases this very high and irregular pressure destroy the silicum die and its connections.
An electronic chip will never get out unscathed from this treatment.