SMD DOES get much easier with practice. I started out like many of you: "rough" soldering followed by de-solder braid ("spiked" with a bit of extra flux) to eliminate bridges. With a little practice, I found it easier and easier to accurately solder the larger stuff (passives,discrete transistors, and SOIC) without bridges. I've not been able to do this with most QFP devices thus far due to the fine pitch.
Solder formulation is also important here. It's much, MUCH harder to use SAC or other Pb-free formulations than good ole' 63/37. My favorite is Kester #44 0.025 63/37; Radio Shack sells 62/36/2 in both 0.015 and 0.022 (probably made by AIM or Kester) and is of noticably higher quality than the other solder formulations they carry (plus the Ag content makes solder joints REALLY pretty!)
Lots of people swear by solder paste followed by "baking"/hot-plates (as suggested above), but I've not tried that technique yet.
The biggest drawback of SMD that I've encountered is in breadboarding. (I don't care how good simulation software gets, I'll always breadboard because it's a lot more fun!)
I think now is the time for hobbyists to warm up to SMD because it is only going to get more prevalent. There WILL be companies making through-hole stuff long into the future, but it will mainly be for purposes of repairing old equipment. It won't be long until commercially-made equipment uses exclusively SMD parts (lots of stuff is already) except perhaps in the power supply or for high-power applications.