Great, thanks! I figured as much and just built it anyway. All the SMT stuff is done, just scrubbed the hell out of it with alcohol. It's weird that the OPA2835 can't even be in humid environments before being soldered, but after it can be submerged. I guess something would crack with the heat. Anyway, I used the solder paste and basically stuck each piece in it, then used the iron to heat it. The result is that you can have the iron in one hand and the tweezers in the other, no need to hold any solder, so you can make sure each piece lines up perfectly.
Actually, this has been the recommended method since day 1 - without solder paste. You apply the solder to a single pad, first. The you re-melt it with the iron in one hand and place the part with tweezers in the other hand. That's fundamental with manual SMD soldering.
I know, and that's how I've always done it, but I've found it a little hard to line up and get it to stay in place. Anyway, the paste just really flowed easily and allowed for repositioning while I soldered. Also, the paste holds the piece in place. Imagine sort of pushing each component into a soft clay or something. While the flux is, in and of itself, sticky this is a little different.