Ok, after about a month of guests and traveling I am finally able to get back to my SOHA II. I was looking at the place to solder the ICE and I noticed that (in addition to lifting the pad on pin #8, which is not connected to anything) the pad on pin #1 is starting to lift on the top of the board (maybe also on pin #2).
Everything looks ok on the bottom of the board. I have attached a picture. Is this going to be a problem? I would rather find out now and get a new board than to wait until the end and find out the amp doesn't work. At this point, I have only added the resistors and two of the IC sockets so it wouldn't be such a big deal to start over (the waiting would be a little annoying though).
I have to admit that I am a bit OC sometimes and *feel* that I want to start over with a nice new perfect board but maybe that is a ridiculous. [If I had second board and second set of resistors, I would start over.]
Also, my board seems a bit warped. I didn't notice this before. Should I be worried? I am wondering if this is another reason to get a new board.
Originally Posted by shellylh
I soldered the opamp socket in backwards in the SOHA II and, afraid that may lead to me putting the opamp in backwards in the future, I desoldered it. However, it took a lot of work/heat and in the process and I lifted one of the pads on the top side of the board. The pad on the bottom side of the board looks intact so I think I should be ok. Will this be ok?
Also, I can no longer fit the (new) socket into the holes. I guess I couldn't get all the solder out. Should I try and buy a new socket with thinner leads or do something else? I am afraid if I try more desoldering, I will just lifts more pads off the board and will have to start from scratch. At this point, I just have the resistors in place (I have been pretty busy) so it wouldn't be the end of the world to start over. Sigh...