I think most plastic-encapsulated devices (as opposed to ceramic or hermetic metal) will absorb moisture, but it's irrelevant to DIYers unless you live in a humid area. If you do, and you think your soldering job might build up enough heat inside the encapsulation to boil absorbed water and crack the thing open, you can put the chips in a 250 degree F or so oven for 10 minutes or so to desiccate the chips slowly.
These warnings have more to do with automated assembly, not just because of the difference in soldering methods, but also because most electronic assembly in the world happens in coastal Southeast Asia, which is pretty much universally humid.
These warnings have more to do with automated assembly, not just because of the difference in soldering methods, but also because most electronic assembly in the world happens in coastal Southeast Asia, which is pretty much universally humid.













as i said, i will reflow everything and check stuff over very thoroughly. i just wanted to get an idea of what kinds of connectivity mistakes i should be looking for.
