I just notice this sentence on Ken's statement
Quote:
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We place acoustic vibration dampening material in various parts inside headphone as well as removal of the diode board.
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Does this impact much over standard HFI-780?
Is this similar mod like the one that Markl do to his D5000?
and I'm asking honest impression, does standard recabling procedure makes the most effect or this dampening mod do the most works for sonic improvement?